The short carbon fiber reinforced copper matrix composites are a promising metal matrix composites.However

copper plating on the surface of the short carbon fiber was conducted owing to the bad wettability between copper and carbon fiber.The electroplating copper and electroless copper process of short carbon fiber were reviewed

and merits and disadvantages of its process were analyzed in order to present its future tendency.With formaldehyde as reducing agent

the purity of the plating copper reaches almost 100%.So copper matrix composites made by such process exhibits excellent conductivity.But formaldehyde is harmful for human body and resulting in environmental pollution.Electroless copper plating in which hypophosphite acts as reducing agent is avirulent and harmless

however

the carbon fiber requires sensitization and activation.In the future

the main aspects will be focused on the system of electroless copper plating with hypophosphite acts as reducing agent

especially on simplifying process and improving the purity of plating copper.