Study on Microstructure and Hardness of Ni-Cu-P Alloy

Chen Pingchang

doi:10.15980/j.tzzz.2000.05.010

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Study on Microstructure and Hardness of Ni-Cu-P Alloy
Issue 5, Pages: 23-24(2000)
Published： 2000 ，
DOI： 10.15980/j.tzzz.2000.05.010

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[1]陈平昌,林汉同.Ni-Cu-P合金显微组织和硬度的研究[J].特种铸造及有色合金,2000(05):23-24+2.

Chen Pingchang. Study on Microstructure and Hardness of Ni-Cu-P Alloy. [J]. Special Casting & Nonferrous Alloys (5):23-24(2000)
[1]陈平昌,林汉同.Ni-Cu-P合金显微组织和硬度的研究[J].特种铸造及有色合金,2000(05):23-24+2. DOI： 10.15980/j.tzzz.2000.05.010.

Chen Pingchang. Study on Microstructure and Hardness of Ni-Cu-P Alloy. [J]. Special Casting & Nonferrous Alloys (5):23-24(2000) DOI： 10.15980/j.tzzz.2000.05.010.

摘要

熔制的Ni Cu P合金显微组织由Ni Cu

Cu Ni两种固溶体枝晶和弥散其中的Ni3P组成。随着磷含量的增加

Ni Cu P合金的硬度显著提高。热处理对Ni Cu P合金的显微组织和硬度无显著影响

Abstract

Microstructure of smelting prepared Ni Cu P alloy consists of Ni Cu and Cu Ni solid solution dendrites and Ni 3P dispersed particles between them. The hardness of Ni Cu P alloy is raised remarkably with the increase of P addition. Heat treatment has no obvious effect on microstructure and hardness of Ni Cu P alloy.