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    • Effects of Electroless Copper Plating on Surface of SiCp on Microstructure and Properties of Al-matrix Composites

    • Vol. 41, Issue 10, Pages: 1289-1294(2021)   

      Published: 2021

    • DOI: 10.15980/j.tzzz.2021.10.021     

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  • An Yi, Yan Fengyun, Chen Tijun. Effects of Electroless Copper Plating on Surface of SiCp on Microstructure and Properties of Al-matrix Composites. [J]. Special Casting & Nonferrous Alloys 41(10):1289-1294(2021) DOI: 10.15980/j.tzzz.2021.10.021.
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相关作者

司乃潮 江苏大学
Chen Liping Si Naichao 江苏大学
肖柏青   哈尔滨工业大学  
陈子勇   哈尔滨工业大学  
徐丽娟   哈尔滨工业大学  
Chen Yuyong Xu Lijuan Chen Ziyong Xiao Baichun   哈尔滨工业大学  
Hu Gang1   西安交通大学  ;  西安交通大学 西安工程科技学院  
Xing Jiandong1   西安交通大学  ;  西安交通大学 西安工程科技学院  

相关机构

Jiangsu University
Harbin Institute of Technology
2,Xi’an Institute of Engineering
1,Xi’an Jiaotong University
Institute of Advanced Forming & Manufacturing and Die & Mold,Nanchang University
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