Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during  Isothermal Comperssion Process

Huang Weichao  Lu Yalin  Jiang Haitao  Li Miaoquan

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Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process
Issue 6, Pages: 8-10(2004)
Published： 2004 ，
DOI：

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[1]黄维超,卢雅琳,江海涛,李淼泉.Al-4Cu-Mg合金半固态压缩过程中的微观组织演变[J].特种铸造及有色合金,2004(06):8-10+76.

Huang Weichao Lu Yalin Jiang Haitao Li Miaoquan. Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process. [J]. Special Casting & Nonferrous Alloys (6):8-10(2004)
[1]黄维超,卢雅琳,江海涛,李淼泉.Al-4Cu-Mg合金半固态压缩过程中的微观组织演变[J].特种铸造及有色合金,2004(06):8-10+76. DOI：

Huang Weichao Lu Yalin Jiang Haitao Li Miaoquan. Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process. [J]. Special Casting & Nonferrous Alloys (6):8-10(2004) DOI：

摘要

研究了SIMA法制备的半固态Al 4Cu Mg合金在不同变形温度、变形程度和应变速率下压缩变形时的微观组织演变

并研究了半固态Al 4Cu Mg合金在高温变形条件下的微观组织形态。研究结果表明

在半固态条件下

晶粒平均尺寸随变形温度的升高而增大 :从 5 40℃到 5 60℃

晶粒平均尺寸增大了 2 %～ 9%

而从 5 60℃到 5 80℃

晶粒平均尺寸增大了3 %～ 16%

后者的增幅比前者大。变形程度增大

晶粒平均尺寸减小

同一试样大变形区的晶粒平均尺寸比小变形区的晶粒平均尺寸小 4%～ 15 %。应变速率减小

晶粒平均尺寸增大

晶粒变得圆整

Abstract

Microstructural evolution of the semi-solid Al-4Cu-Mg alloy prepared by SIMA at different deformation temperatures and deformation degree as well as strain rates during isothermal compression process was investigated. Microstructure of the semi-solid alloy under high temperature deformation condition was observed also. The results showed that the average grain size increased by 2%～9% with deformation temperature increase from 540 ℃ to 560 ℃ and increase by 3%～16% from 560 ℃ to 580 ℃ while decreased with deformation degree increase. The average grain size in large deformation area was smaller by 4%～15% than in small deformation area in same specimen. Average grain size increased and grain became round with strain rates reduction.