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    • Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process

    • Huang Weichao Lu Yalin Jiang Haitao Li Miaoquan

      1 ,

      卢雅琳

      1 ,

      江海涛

      1 ,

      李淼泉

      1
    • Issue 6, Pages: 8-10(2004)   

      Published: 2004

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  • Huang Weichao Lu Yalin Jiang Haitao Li Miaoquan. Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process. [J]. Special Casting & Nonferrous Alloys (6):8-10(2004) DOI:
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    Abstract

    Microstructural evolution of the semi-solid Al-4Cu-Mg alloy prepared by SIMA at different deformation temperatures and deformation degree as well as strain rates during isothermal compression process was investigated. Microstructure of the semi-solid alloy under high temperature deformation condition was observed also. The results showed that the average grain size increased by 2%~9% with deformation temperature increase from 540 ℃ to 560 ℃ and increase by 3%~16% from 560 ℃ to 580 ℃ while decreased with deformation degree increase. The average grain size in large deformation area was smaller by 4%~15% than in small deformation area in same specimen. Average grain size increased and grain became round with strain rates reduction.

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    Keywords

    Semi-solid Al Alloy; Compression Deformation; Microstructure; Grain Size

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