Effects of Ag Addition on Properties of Sn-9Zn Lead-free Solder Alloys

Huang Huizhen; Huang Qisen; Peng Shu; Zhou Lang

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Effects of Ag Addition on Properties of Sn-9Zn Lead-free Solder Alloys
Issue 3, Pages: 179-181(2006)
Published： 2006 ，
DOI：

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[1]黄惠珍,黄起森,彭曙,周浪.添加Ag对Sn-9Zn无铅钎料合金性能的影响[J].特种铸造及有色合金,2006(03):179-181+128.

Huang Huizhen, Huang Qisen, Peng Shu, et al. Effects of Ag Addition on Properties of Sn-9Zn Lead-free Solder Alloys. [J]. Special Casting & Nonferrous Alloys (3):179-181(2006)
[1]黄惠珍,黄起森,彭曙,周浪.添加Ag对Sn-9Zn无铅钎料合金性能的影响[J].特种铸造及有色合金,2006(03):179-181+128. DOI：

Huang Huizhen, Huang Qisen, Peng Shu, et al. Effects of Ag Addition on Properties of Sn-9Zn Lead-free Solder Alloys. [J]. Special Casting & Nonferrous Alloys (3):179-181(2006) DOI：

摘要

通过试验研究了添加Ag对Sn-9Zn无铅钎料合金在Cu表面的润湿性、焊点剪切强度、抗蠕变性能与组织的影响。结果表明

当添加量较低时

Ag能够改善Sn-9Zn合金熔体对Cu的润湿性和焊点剪切强度

而添加量较高时Ag则会使它们降低;就焊点润湿性和剪切强度而言

最佳Ag含量（质量分数）为0.30%

.60%。Ag的添加能显著提高Sn-9Zn合金体材的抗蠕变性能。显微分析表明

在含Ag合金中形成了弥散分布、尺度为微米级的Ag-Zn化合物颗粒

这可能是合金得到强化的原因。

Abstract

Effects of Ag addition on the wettability on the copper surface

shear strength of solder joints

creep strength and microstructure of Sn-9Zn lead-free solder alloys have been investigated experimentally. The results show that lower Ag addition can improve the wettability and shearing strength of solder joints of Sn-9Zn alloy melt on the Cu surface while higher Ag addition can be inferior to them. There exists an optimum Ag content ranging from 0.3 % to 0.6% for wettability and shearing strength of solder joints. The creep strength of Sn-9Zn solder alloys can be increased by the addition of Ag

which may be attributed to the micrometer-sized dispersed Ag-Zn particles formed in the bulk of Sn-9Zn-xAg solder alloy.