Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux

Fan Yanli; Zhang Keke; Wang Shangqi; Cheng Guanghui; Wang Yaoli; Yu Yangchun

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Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux
Issue 9, Pages: 604-606(2006)
Published： 2006 ，
DOI：

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[1]樊艳丽,张柯柯,王双其,程光辉,王要利,余阳春.水洗钎剂下SnAgCu系钎料对不同基板的润湿特性[J].特种铸造及有色合金,2006(09):604-606+536.

Fan Yanli, Zhang Keke, Wang Shangqi, et al. Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux. [J]. Special Casting & Nonferrous Alloys (9):604-606(2006)
[1]樊艳丽,张柯柯,王双其,程光辉,王要利,余阳春.水洗钎剂下SnAgCu系钎料对不同基板的润湿特性[J].特种铸造及有色合金,2006(09):604-606+536. DOI：

Fan Yanli, Zhang Keke, Wang Shangqi, et al. Wettability of SnAgCu Lead-free Solder Containing Low Ag for Different Substrate with Water-soluble Flux. [J]. Special Casting & Nonferrous Alloys (9):604-606(2006) DOI：

摘要

选用商用水洗钎剂

采用润湿平衡法

研究了低银SnAgCu系钎料合金在表面贴装元器件及紫铜板上的润湿特性。研究结果表明

在Ag的质量分数为2.5%时

SnAg2.5Cu0.7钎料合金具有最大的润湿力和铺展面积及最小的润湿角。其润湿力高于现行商用SnAg3.8Cu0.7钎料合金

完全可满足表面组装元器件对其润湿性能的要求。

Abstract

The wettability of SnAgCu solder containing low Ag on surface mount component and Cu substrate has been investigated by the wetting balance method with commercial water-soluble flux. The experimental results show that the highest wetting force and the biggest spreading area as well as the smallest wetting angle can be obtained with 2.5% Ag content

which can fully meet the wettability requirement of surface mount component due to its wetting force higher than that of commercial Sn3.8Ag0.7Cu alloy solder.