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    • Preparation of Fe-SiCp Compound Electroplate Friction Layer

    • Wang Xuran

      1 ,

      Feng Xiaoming

      1 ,

      Wang Zhong

      1
    • Issue 9, Pages: 587-589(2006)   

      Published: 2006

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  • Wang Xuran, Feng Xiaoming, Wang Zhong. Preparation of Fe-SiCp Compound Electroplate Friction Layer. [J]. Special Casting & Nonferrous Alloys (9):587-589(2006) DOI:
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    Abstract

    Q235-SiCp surface wear-friction composites have been prepared by compound electroplate processing. The effects of concentration of SiCp in plating solution, current density, average pH and temperature of plating solution on microstructure and properties of the electroplated layer were investigated. The results show that the dry friction coefficient of electroplated layer is in the range of 0.550.60,and its wear rate is less than 0.42×10 -7 cm3/J with the concentration of 35 g/L of SiCp in plating solution and current density of 3.5 A/dm2, which can meet the requirements of friction materials.

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    Keywords

    Compound Electroplate; SiCp Particle; Friction Layer

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