Interface Morphology and Microstructure Evolution of Cu-0.5Cr Alloy in Directional Solidification

Li Xiaoli; Li Jinshan; Hui Rui; Kou Hongchao; Tang Ling; Fu Hengzhi

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Interface Morphology and Microstructure Evolution of Cu-0.5Cr Alloy in Directional Solidification
Issue 9, Pages: 666-669(2007)
Published： 2007 ，
DOI：

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[1]李晓历,李金山,胡锐,寇宏超,唐玲,傅恒志.定向凝固下Cu-0.5Cr合金的界面形态和组织演化[J].特种铸造及有色合金,2007(09):666-669+652.

Li Xiaoli, Li Jinshan, Hui Rui, et al. Interface Morphology and Microstructure Evolution of Cu-0.5Cr Alloy in Directional Solidification. [J]. Special Casting & Nonferrous Alloys (9):666-669(2007)
[1]李晓历,李金山,胡锐,寇宏超,唐玲,傅恒志.定向凝固下Cu-0.5Cr合金的界面形态和组织演化[J].特种铸造及有色合金,2007(09):666-669+652. DOI：

Li Xiaoli, Li Jinshan, Hui Rui, et al. Interface Morphology and Microstructure Evolution of Cu-0.5Cr Alloy in Directional Solidification. [J]. Special Casting & Nonferrous Alloys (9):666-669(2007) DOI：

摘要

采用定向凝固工艺研究了不同速率下Cu-0.5Cr合金的凝固组织演化。结果表明

在温度梯度为200K/cm下

定向凝固速率由2μm/s增加到500μm/s时

凝固组织依次呈现平界面组织→胞状组织→枝晶组织→细胞状组织→板条状组织。试验中凝固速率达到10μm/s后

合金定向凝固组织中存在非平衡凝固的共晶组织

其体积分数随凝固速率的增加逐渐减少。不同凝固速率下初生α-Cu的一次枝晶间距值位于KF模型和Hunt-Lu模型计算结果之间。

Abstract

Effects of directional growth rate on solidification structure of Cu-0.5Cr alloy have been described in directional solidification. It is found that the solidification structure of the alloy is evolved from planar to cellular to coarse dendrite to hexagon cellular

and then to fine plate-like structure with varying solidified growth rate from 2 μm/s to 500 μm/s in the condition of 200K/cm temperature gradient. The presence of eutectic phase from non-equilibrium solidification can be observed in directional solidification structure of the alloy with the solidification rate more than 10μm/s

whose volume fraction is reduced with the increase of the solidification rate. The value of primary dendritic arm spacing in Cu-0.5Cr alloy is located between the calculated results of the KF model and the Hunt-Lu model.