Effects of Ni on the performance of Sn2.5Ag0.7Cu0.1RE solder alloy and its solder joints have been examined. The results indicate that the performance of solders and its joints can be improved with the Ni addition

especially the elongation of Sn2.5Ag0.7Cu0.1RE solder alloy with 5% Ni addition can be improve greatly without degrading strength

which is 1.4 times higher than that of the commercial Sn3.8Ag0.7Cu solder alloy. Meanwhile

the creep rupture life of the solder joints is the highest

which is 13.3 times longer that that of Sn2.5Ag0.7Cu0.1RE solder joints

and is markedly longer than that of the commercial Sn3.8Ag0.7Cu solder alloy

meeting the requirements of micro-electric trade for lead-free solder alloy with high strength and toughness as well as high reliability.