Properties of Cu-Ni-Si Based Alloy for Lead Frame

Li Yinhua1; Liu Ping1; Tian Baohong1; Jia Shuguo1; Ren Fengzhang1; Zhang Yi2

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Properties of Cu-Ni-Si Based Alloy for Lead Frame
Issue 5, Pages: 404-406(2008)
Published： 2008 ，
DOI：

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[1]李银华,刘平,田保红,贾淑果,任凤章,张毅.Cu-Ni-Si基引线框架材料的性能研究[J].特种铸造及有色合金,2008(05):404-406+328.

Li Yinhua1, Liu Ping1, Tian Baohong1, et al. Properties of Cu-Ni-Si Based Alloy for Lead Frame. [J]. Special Casting & Nonferrous Alloys (5):404-406(2008)
[1]李银华,刘平,田保红,贾淑果,任凤章,张毅.Cu-Ni-Si基引线框架材料的性能研究[J].特种铸造及有色合金,2008(05):404-406+328. DOI：

Li Yinhua1, Liu Ping1, Tian Baohong1, et al. Properties of Cu-Ni-Si Based Alloy for Lead Frame. [J]. Special Casting & Nonferrous Alloys (5):404-406(2008) DOI：

摘要

分析了固溶处理、冷变形以及时效处理对Cu-Ni-Si系列合金的显微硬度、电导率的影响规律。同时通过设计3种不同成分（Cu-Ni-Si、Cu-Ni-Si-Ag、Cu-Ni-Si-P）的引线框架材料

分析了合金成分Ag、P对Cu-Ni-Si基引线框架材料性能的影响。结果表明

微量P能有效提高合金的显微硬度

稍微降低了铜基体的电导率;微量的Ag能提高合金的硬度

但作用没有P明显

而且Ag能提高铜基体的电导率。

Abstract

Effects of solid solution

cold deformation and aging on micro-hardness and electrical conductivity of Cu-Ni-Si alloy were investigated. Meanwhile

effects of Ag and P on properties of Cu-Ni-Si alloy were examined. The results reveal that minor P content can effectively improve the microhardness of alloy with the slight decrease of electric conductivity. Minor Ag can increase both micro-hardness and electric conductivity of the alloy.