Effects of Aging on Microstructure and Properties of Cu-2.0Ni-0.5Si Alloy

Zhang Yi1; Liu Ping1; Tian Baohong3; Chen Xiaohong1; Jia Shuguo3; Ren Fengzhang3; Long Yongqiang3

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Effects of Aging on Microstructure and Properties of Cu-2.0Ni-0.5Si Alloy
Issue 10, Pages: 810-813(2008)
Published： 2008 ，
DOI：

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[1]张毅,刘平,田保红,陈小红,贾淑果,任凤章,龙永强.时效对Cu-2.0Ni-0.5Si合金组织和性能的影响[J].特种铸造及有色合金,2008(10):810-813+738.

Zhang Yi1, Liu Ping1, Tian Baohong3, et al. Effects of Aging on Microstructure and Properties of Cu-2.0Ni-0.5Si Alloy. [J]. Special Casting & Nonferrous Alloys (10):810-813(2008)
[1]张毅,刘平,田保红,陈小红,贾淑果,任凤章,龙永强.时效对Cu-2.0Ni-0.5Si合金组织和性能的影响[J].特种铸造及有色合金,2008(10):810-813+738. DOI：

Zhang Yi1, Liu Ping1, Tian Baohong3, et al. Effects of Aging on Microstructure and Properties of Cu-2.0Ni-0.5Si Alloy. [J]. Special Casting & Nonferrous Alloys (10):810-813(2008) DOI：

摘要

研究了时效温度和时效时间对不同冷变形条件下Cu-2.0Ni-0.5Si合金组织和性能的影响。结果表明

合金经900℃固溶

在经不同冷变形后时效

第二相呈弥散分布

当变形量为80%

时效温度为500℃

时效时间为1h时

其显微硬度HV达到250

电导率达到22.625MS/m

与未经过预冷变形的合金时效相比

合金能获得较高的显微硬度与电导率。时效前的预冷变形能够有力的促进合金在时效过程中第二相的析出

从而提高合金的显微硬度和电导率。合金经40%预冷变形

450℃×4h时效后

其抗拉强度达到620MPa。拉伸试样断口表现出明显的塑性断裂特征。

Abstract

Effects of aging temperature and aging time on microstructure and properties of Cu-2Ni-0.5Si alloy were investigated after varying cold deformation. The results indicate that the secondary phase is dispersively distributed in the alloy with solid solution at 900 ℃ and then aging treatment after varying cold deformation. The micro-hardness and electronic conductivity of the 80% deformed alloy with aging at 500 ℃ for 1h are 250 and 22.625 MS/m

respectively

exhibiting higher comprehensive properties compared with those without cold deformation. Pre-cold deformation before aging can strongly accelerate the precipitation of secondary phase in the alloy during aging

which is responsible for the improvement of micro-hardness and electronic conductivity. The tensile strength of the 40% pre-cold deformed alloy with aging at 450 ℃ for 4 h can reach up to 620 MPa

and the fracture morphology is characterized by typical ductile fracture mode.