Growth Behavior of Intermetallic Compounds（IMC） Between Sn-2.5Ag-0.7Cu-0.1RE and Cu Substrate During Aging

Han Lijuan1; Zhang Keke1; Wang Yaoli1; Zhu Yaomin2; Zhao Guoji2

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Growth Behavior of Intermetallic Compounds（IMC） Between Sn-2.5Ag-0.7Cu-0.1RE and Cu Substrate During Aging
Issue 11, Pages: 895-897(2008)
Published： 2008 ，
DOI：

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[1]韩丽娟,张柯柯,王要利,祝要民,赵国际.Sn-2.5Ag-0.7Cu-0.1RE/Cu时效点界面IMC的生长行为[J].特种铸造及有色合金,2008(11):895-897+820.

Han Lijuan1, Zhang Keke1, Wang Yaoli1, et al. Growth Behavior of Intermetallic Compounds（IMC） Between Sn-2.5Ag-0.7Cu-0.1RE and Cu Substrate During Aging. [J]. Special Casting & Nonferrous Alloys (11):895-897(2008)
[1]韩丽娟,张柯柯,王要利,祝要民,赵国际.Sn-2.5Ag-0.7Cu-0.1RE/Cu时效点界面IMC的生长行为[J].特种铸造及有色合金,2008(11):895-897+820. DOI：

Han Lijuan1, Zhang Keke1, Wang Yaoli1, et al. Growth Behavior of Intermetallic Compounds（IMC） Between Sn-2.5Ag-0.7Cu-0.1RE and Cu Substrate During Aging. [J]. Special Casting & Nonferrous Alloys (11):895-897(2008) DOI：

摘要

采用扫描电镜及X射线衍射等检测手段

研究了Sn-2.5Ag-0.7Cu-0.1RE/Cu在时效过程中界面区金属间化合物（IMC）的形成和生长特点。试验结果表明

钎焊接头在85、125、150℃时效时

在靠近Cu侧形成层状Cu3SnIMC。随时效时间延长

钎焊后形成的波浪状Cu6Sn5IMC转变为较大尺寸的扇贝状

然后再转变为层状。时效过程中钎焊界面Cu6Sn5IMC和Cu3SnIMC的生长厚度均与时效时间的平方根呈线性关系

其生长受扩散机制控制

激活能分别为81.7和92.3kJ/mol。

Abstract

Formation and growth of IMC in interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu during aging were investigated by SEM（scanning electron microscope） and XRD（X-ray diffraction）.The results reveal that lamellar Cu3Sn phase near by Cu side in the solder joint can be created with aging at 85 ℃

125 ℃ and 150 ℃.With extending aging time

formed Cu6Sn5 phase in the solder joint is converted from wave-like structure into scallop-like one with bigger size and then into lamellar one.The growth thickness of Cu6Sn5 phase and Cu3Sn phase are linearly proportional to the square root of aging time

which is controlled by diffusion mechanism.The activation energies are 81.7kJ/mol and 92.3kJ/mol

respectively.