Silver films were made by thick film method with ultrafine silver powders prepared by DC（direct current） arc plasma evaporation. Effects of slurry compositions on the properties of the silver conductor with thick film had been investigated by varying proportion of slurry composition with the help of OM

EDS. The results indicate that the slurry viscosity is increased with the increase of solid phase content

and the optimized solid phase content is 80%. At the experimental range

the sheet resistance of the sintered thick film is firstly decreased

then increased with increasing in glass powder content

and desirable glass content is 3%. In addition

sizes of glass powder and Ag powder have evidently affected the properties of Ag conductor slurry. There exists a desirable match in Ag powder and glass powder for conductivity. The Ag powder with average size of 102.92 nm and 204.26 nm exhibits good solderability

and size of glass powder also affects the solderability of silver conductor with thick film to some extent.