切换中文
Views : 46 Downloads: 175 CSCD: 2
  • Export

  • Share

  • Collection

  • Album

    • Near-net-shape Preparation and Properties of SiCp/A356 Composites Baseplate

    • Zhang Jianyun

      1 ,

      Yu Zhihua

      1 ,

      Zou Aihua

      1 ,

      Zhou Xianliang

      1
    • Vol. 29, Issue 4, Pages: 298-300(2009)   

      Published: 2009

    Scan for full text

  • Quote

  • Zhang Jianyun, Yu Zhihua, Zou Aihua, et al. Near-net-shape Preparation and Properties of SiCp/A356 Composites Baseplate. [J]. Special Casting & Nonferrous Alloys 29(4):298-300(2009) DOI:
  •  
  •  
    Sections

    Abstract

    Near-net-shape SiCp/A356 composites baseplate was successfully prepared with SiCp preform by pressureless infiltration method. Bonding mechanism of sintered SiC preform, and effects of infiltration temperature and infiltration time on the relative density of the composites were approached. Meanwhile, properties of the composites baseplate were tested. The results reveal that SiO2 phase generated on the surface layer of sintered SiC is responsible for the bonding role in SiC porous preform. Relative density of the composites baseplate is increased with increasing in infiltration temperature and infiltration time. Thermal expansion coefficient and thermal conductivity of the composites baseplate vary at (11.1512.46)×10-6 K-1 and at 110.00194.282W/(m·K), respectively, at 50200℃. The ambient bending strength of the composites baseplate reaches 210.8MPa.

    transl

    Keywords

    Aluminum Matrix Composites; SiCp Preform; Pressureless Infiltration; Thermo-physical Properties; Bending Strength

    transl

    Alert me when the article has been cited
    Submit

    Related Author

    Zhu Hexiang Li Zoujian Zeng Guoxun Xiong Huang Yang Weijun   广东工业大学  
    黎祚坚   广东工业大学  
    曾国勋   广东工业大学  
    熊凰   广东工业大学  
    扬卫军   广东工业大学  
    Xie Shenghui Zeng Xierong Tang Jiaoning   深圳大学  ;  中南大学  
    曾燮榕   深圳大学  ;  中南大学  
    汤皎宁   深圳大学  ;  中南大学  

    Related Institution

    Guangdong University of Technology
    Shenzhen University, Shenzhen, China) Chen Kanghua Liu Hongwei
      中南大学  
    Harbin Institute of Technology
    Nanjing University of Science and Technology
    0