Thixo-compression behavior and microstructure of SiCp/Al alloy matrix composites were investigated with the help of Gleeble-1500 thermal-mechanical simulator under different deformation temperatures and different deformation rates.It is found that,with increasing in strain,compressive stress of the composites is firstly increased rapidly,then decreased rapidly,and at last increased slowly.In addition,with decreasing in deformation temperature or increasing in deformation rates,compressive stress is increased in semi-solid composites.After compressive deformation,more small SiC particles with average size less than 20μm and approximately 55% in volumetric fraction are mainly not distributed in severe deformation zone but in free deformation zone,which shows that high SiC zone can be created from separation of liquid-solid phase by semi-solid thixo-compression,meeting the requirements of electronic package materials.