Huang Hongjun, Yuan Xiaoguang, Jia Zhen, et al. Effects of Size Changing on Electric Conductivity of Copper Cladding Aluminum Plate. [J]. Special Casting & Nonferrous Alloys 30(5):444-446(2010)
Huang Hongjun, Yuan Xiaoguang, Jia Zhen, et al. Effects of Size Changing on Electric Conductivity of Copper Cladding Aluminum Plate. [J]. Special Casting & Nonferrous Alloys 30(5):444-446(2010)DOI:
Effects of Size Changing on Electric Conductivity of Copper Cladding Aluminum Plate
摘要
利用有限元分析软件模拟计算了Cu-Al-Cu复合板参数对导电性能的影响。模拟结果表明
在加载一定的情况下
Cu-Al复合板的导电性随着铜层厚度的增加而提高
Cu层厚度超过0.5mm
Cu层厚度变化对复合板阻抗影响很小;当Cu-Al复合板宽度保持一定时
随着复合板厚度的增加
复合板的阻抗呈明显的下降趋势
但复合板厚度的增加对复合板导电性能的影响越来越小;当Cu层厚度保持一定时
随着复合板厚度的增加
复合板的阻抗逐渐减小
随着复合板宽度的增加
厚度对其复合板阻抗的影响也越来越小。
Abstract
Effects of cladding size changes on electric conductivity of copper-aluminum-copper cladding plate were examined by the FEM (finite element method) software.It is found that with a fixed loading
electric conductivity of copper-aluminum-copper cladding plate is increased with increasing in copper thickness.However
with copper thickness more than 0.5 mm
effects of copper thickness on impedance of cladding plate can be neglected.At a fixed cladding width
with increasing in cladding thickness
impedance of the cladding plate is greatly decreased
while effects on electric conductivity are slowly weakened.At a given copper thickness
with increasing in cladding thickness
impedance of the cladding plate is decreased
and with increasing in width of cladding plate
effects of thickness on impedance of the plate are greatly weakened.