Preparation of Cu/Al Liquid-solid Compound Bimetallic Composites by Hot-dipping Technology

Yu Baoyi; Qiao Gang; Chen Yan; Su Bo; Liu Chunyu

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Preparation of Cu/Al Liquid-solid Compound Bimetallic Composites by Hot-dipping Technology
Vol. 30, Issue 6, Pages: 581-583(2010)
Published： 2010 ，
DOI：

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[1]于宝义,乔刚,陈岩,苏薄,刘春雨.热浸镀法Cu/Al液固复合的研究[J].特种铸造及有色合金,2010,30(06):581-583+598.

Yu Baoyi, Qiao Gang, Chen Yan, et al. Preparation of Cu/Al Liquid-solid Compound Bimetallic Composites by Hot-dipping Technology. [J]. Special Casting & Nonferrous Alloys 30(6):581-583(2010)
[1]于宝义,乔刚,陈岩,苏薄,刘春雨.热浸镀法Cu/Al液固复合的研究[J].特种铸造及有色合金,2010,30(06):581-583+598. DOI：

Yu Baoyi, Qiao Gang, Chen Yan, et al. Preparation of Cu/Al Liquid-solid Compound Bimetallic Composites by Hot-dipping Technology. [J]. Special Casting & Nonferrous Alloys 30(6):581-583(2010) DOI：

摘要

采用热浸镀方法研究了助镀剂KF在热浸镀中促进Cu/Al液固复合方面的作用

并且分析了热浸镀中Al液温度、浸镀时间对冶金反应层成分和厚度的影响。结果表明

试样经过表面处理

在助镀剂中浸泡4min

浸镀温度为720℃

浸镀时间为25s时得到的复合效果最好。

Abstract

The roles of plating assistant agent KF in Cu/Al liquid-solid compound during hot-dipping process were analyzed

and effects of liquid aluminum temperature

dipping time on thickness of metallurgical bonding layer and its constituent were described. An acceptable hot-dipping parameters were determined. Desirable compound effects can be obtained in the Cu/Al bimetallic composites with dipping surface treated samples in the KF solution for 4 min and then hot-dipping at 720℃ for 25 s

which provides a theoretical basis for further investigating Cu/Al liquid-solid compound technology.

关键词

热浸镀铝助镀剂铜铝复合材料液固复合

Keywords

Hot-dipping AluminizationPlating Assistant Agent KFCopper Aluminum CompositesLiquid-solid Compound

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