Microstructure and Properties of Nano-MgO Particle Reinforced Copper Matrix Composites Prepared by Powder Metallurgy

Zheng Cuihua1; Song Kexing1; Guo Xiuhua1; Li Shaolin1; Ding Zongye1

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Microstructure and Properties of Nano-MgO Particle Reinforced Copper Matrix Composites Prepared by Powder Metallurgy
Vol. 31, Issue 10, Pages: 955-958(2011)
Published： 2011 ，
DOI：

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[1]郑翠华,宋克兴,国秀花,李韶林,丁宗业.粉末冶金法制备纳米MgO颗粒增强铜基复合材料[J].特种铸造及有色合金,2011,31(10):955-958.

Zheng Cuihua1, Song Kexing1, Guo Xiuhua1, et al. Microstructure and Properties of Nano-MgO Particle Reinforced Copper Matrix Composites Prepared by Powder Metallurgy. [J]. Special Casting & Nonferrous Alloys 31(10):955-958(2011)
[1]郑翠华,宋克兴,国秀花,李韶林,丁宗业.粉末冶金法制备纳米MgO颗粒增强铜基复合材料[J].特种铸造及有色合金,2011,31(10):955-958. DOI：

Zheng Cuihua1, Song Kexing1, Guo Xiuhua1, et al. Microstructure and Properties of Nano-MgO Particle Reinforced Copper Matrix Composites Prepared by Powder Metallurgy. [J]. Special Casting & Nonferrous Alloys 31(10):955-958(2011) DOI：

摘要

采用粉末冶金法制备了不同体积分数的纳米MgO颗粒增强铜基复合材料

测定了MgO/Cu复合材料的密度、硬度和电导率

并进行了微观组织观察。结果表明

随着MgO颗粒含量的增加

MgO/Cu复合材料的密度和电导率降低

硬度先升高后降低

当MgO体积分数达到2.5%时

综合性能最好。微观组织观察表明

热挤压后

增强相颗粒弥散分布在铜基体上;随着增强相体积分数的增加

颗粒出现团聚并聚集在铜基体晶界处。

Abstract

The varied volumetric fraction nano-MgO particle reinforced copper matrix composites（MgO/Cu composites） were prepared by powder metallurgy technology. The hardness

density and electric conductivity of the MgO/Cu composites were examined

and its microstructure was observed. The results indicate that

with increasing in MgO particle content

density and electric conductivity of the composites are decreased

however

hardness is firstly increased and then decreased. The desirable comprehensive properties of the composites can be obtained with 2.5% MgO particle. Reinforcement is uniformly and dispersedly distributed into the copper matrix after hot extrusion. With increasing in volumetric fraction of reinforcement

nano-particles appear together and gather in grain boundary of copper matrix.