Heat Flow and Temperature Gradient of Die

Yang Yuguo

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Heat Flow and Temperature Gradient of Die
Issue S1, Pages: 130-133(2002)
Published：2002
DOI：
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[1]杨裕国.压铸模的热流量与温度梯度[J].特种铸造及有色合金,2002(S1):130-133. DOI：

Yang Yuguo. Heat Flow and Temperature Gradient of Die[J]. Special Casting & Nonferrous Alloys, 2002, (S1): 130-133. DOI：

摘要

提出用型壁和界面层的温度梯度度量压铸模热流量的观点和方法。通过实测和计算

研究不同冷却条件对型壁温度、合金释放的热量、型壁增加的热量的影响。计算机凝固过程数值模拟

得到试验的系统热阻为 2 .6cm2 ·K·s/J。

Abstract

This paper presents a point of view and a method which is to use temperature gradient in die wall and boundary layer as estimation of quantity of heat flow of dies. Through pratical measurement and calculation

the influence of die wall temperature

metal released heat

dies wall increased heat by different cooling conditions have been researched. The heat resistance of computer solidification process numerical value simulation is 2.6 cm 2·K·s/J in the die system.