“In the field of materials science, researchers have prepared low Sn content Cu Ni alloys using the "medium frequency melting+homogenization annealing+hot extrusion" process. The microstructure and mechanical properties of the alloy were studied through EBSD, XRD, SEM, TEM, and tensile testing. It was found that increasing the mass ratio of Ni to Sn can improve the tensile strength, yield strength, and elongation of alloys, providing new ideas for optimizing alloy properties.”